The XY Theta indexing table: a solution to restricted
movement in wire bonding.
• Our assignment
was to be able to carry out bumping on 125 mm diameter silicon wafers,
while the original equipment working area did not enable the whole
wafer surface to be covered.
• The solution we selected enabled
the workpiece to be presented on line, without the operator having to
move the substrate between programs. The solution was especially
effective in avoiding vibration interference which might affect the
stabilization time between movements.
To
achieve this, we had to design a presentation system where the centre
of gravity was constantly in the surface of the table in order to avoid
overhang, at the same time ensuring the indexing the whole workpiece.
of the part.
Our
design is based on a three axis presentation system:
• An X axis,
• A Y axis,
• A Theta axis.
This
design enables processing of the first half of the substrate, after a
180° rotation of the part, the second half.
The
X axis is a classic design (recirculating ball screw an slider).
The Y axis is linear stepper motor.
The Theta axis is rotary stepper motor.
The results
enable us to achieve our assigned objective with total precision.
This experience
now enable us to offer new testing and pilot production opportunities
for our customer's existing machines. In addition, we have adapted this
innovation to other applications in order to be able to process
substrates, with or without rotation, where the sizes exceed the
capacity of the machines being used.