Caléo Engineering, a Limited Company with a capital of 500,000 Euro, subsidiary of CALEO GROUP, was founded on July 1985, and was formely known as Robotherm.

Historically the company was established to ensure the manufacture of controlled atmosphere reflow ovens.

Subsequently the company began to develop indexing systems for semi-conductor assembly equipment.

In 1989, the introduction of the smart card opened up new perspectives in terms of assembly equipment sales, and which lead Caléo Engineering to develop solutions adapted to this application, opening the way for a wide range of customized solutions for assembly equipment used in micro electronics market.

Today, Caléo Engineering, offers :

• Standard products adapted for semiconductor, smart cards, with or without contacts, C.O.B (Chip on Board), C.O.F (Chip on Flex), S.M.T (Surface Mounted Technology) and hybrids applications.
• "Add-on solutions for standard equipment.
• Customized subsystems for the micro electronic assembly applications in partnership with OEM's.
• "Turnkey" solutions.

 

Based in the Paris region, Caléo Engineering infrastructures include office space and an assembly workshop

Development is carried out using the newest C.A.D tools. Assembly and testing is performed in our workshop. Acceptance and integration of sub systems is carried out in our premises with final buy off typically done at customer's sites.

Our skill cover the following areas:

• Mechanical,
• Pneumatic,
• Electrical,
• Software development,

As well as :

• Consultancy on robotics,
• Information technology,
• Automatisation solutions,
• Develpment of assembly processes.

Products conform to European Community (E.E.C.) Standards.

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